Products

LDH-X0300 (266,Pico)

  • Non-thermal processing
  • Sample Processing Available
  • New
  • EU RoHS
  • CE Compliance

Industrial DUV High Power Picosecond Laser

LDH-X0300 (266,Pico)

  • Features
  • Specifications
  • Applications

The LDH-X0300 is DUV Picosecond Hybrid Laser for industrial use suitable for "High-Quality" & "High-Precision" material processing.

Main characteristics
Design and Technology

LDH-X0300 is a MOPA laser with a combination of LD seed laser, Fiber & Bulk amplifiers. This simple design achieves a compact size, long lifetime and high reliability. Laser amplification by maintaining extreme narrow spectrum had improved the wavelength conversion efficiency dramatically.

High Power

This laser is a "Gain-Switched" high power 266nm Picosecond Laser, with <35ps pulse, 2.0W (Max 3.0W)@ 100kHz power and Max 60uJ pulse energy, designed for industrial applications.

High Quality material processing

This product enables material processing with a combination of multiphoton absorption & ablation process, which leads to "High Quality" & "High Precision" micromachining.

Beam Property
Wavelength 266nm
Average Power > 2 W @ 100 kHz
Repetition Rate 50 kHz to 1000 kHz
Pulse Width 50 ps (typ.)
Beam Diameter 2.2mm +/- 0.5 mm
Beam Divergence < 1.0 mrad
Mode Quality M2 < 1.5
Spatial Mode TEM 00

*The above information may be updated without notice. Please verify these specifications with Spectronix or the seller before purchasing.

System Configuration
Laser Head W 360 x D 1050 x H141 mm 57 kg
Laser Controller W 570 x D 626 x H1100 mm 110 kg
Cooling System Water-cooled
Power Supply AC 100 to 240 V +/- 10 %, 50/60 Hz
Power Consumption Max 1500 W
Operational Temperature 15 to 30degrees
Storage Temperature 0 to 50 degrees
Operational and Storage Humidity Levels 10 to 85 %

*The above information may be updated without notice. Please verify these specifications with Spectronix or the seller before purchasing.

View All Applications
  • Laser micromachining
    • Cutting
    • Repairing
    • Marking
    • Grafting Materials
    • Submicron Processing
    • Scribing
    • Thin Film Ablation
    • Drilling
    • Trimming