532nm Q-Switched DPSS LASER
LVE-G1000（532,Nano）
The LVE-G1000 is a 10W green (532nm) nanosecond laser for micro-processing.
It offers the reliability and stability demanded for industrial use.
The LVE-G1000 is a highly functional Q-switched pulsed laser. It uses Nd:YV04 crystal and is designed to process any kinds of materials. Combining its short pulse width with a high beam quality, it can achieve extremely high quality results in micro-processing.
Main characteristics
Air cooling with minimal maintenance
With our expertise on thermal analysis and thermal control technology, we achieved an air-cooling system for this kind of high power laser. This makes the maintenance much easier and lowers significantly the running-cost.
Extremely compact Q-switched DPSS Laser
Its very small size makes it easier to insert into the system, allowing greater design flexibility.
Beam Property
| Wavelength | 532nm |
|---|---|
| Average Power | > 10W @ 50 kHz |
| Repetition Rate | Single shot to 200kHz |
| Pulse Width | 15nsec @ 50kHz / 10nsec @ 20kHz |
| Beam Diameter | 1.0 mm |
| Beam Divergence | 4.5 mrad (Full Angle) |
| Mode Quality | M2 < 1.3 |
| Spatial Mode | TEM00, Linear Polarization |
| Stability | +/- 2% |
∗The above information may be updated without notice. Please verify these specifications with Spectronix or the seller before purchasing.
System Configuration
| Laser Head | W 150 x D 350 x H 125 mm 8kg |
|---|---|
| Laser Controller | W 250 x D 380 x H 400.5 mm 26kg |
| Cooling System | Air cooled (Laser head and Controller) |
| Power Supply | Single Phase AC 100 to 240V +/- 10%, 50/60Hz |
| Power Consumption | Maximum 1000W |
| External Control | External Trigger (TTL) |
| Warm-up Time | < 20 min from cold start, < 5 min from warm start |
| Operational Temperature | 15 to 35°C |
| Storage Temperature | 0 to 50°C |
| Operational and Storage Humidity Levels | 10 to 85%RH (Non-condensing) |
∗The above information may be updated without notice. Please verify these specifications with Spectronix or the seller before purchasing.
View All Applications
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Laser micromachining
- Cutting
- Scribing
- Thin Film Ablation
- Drilling
- Trimming
- Repairing
- Marking
- Grafting Materials
- Submicron Processing
