Products

532nm Q-Switched DPSS LASER

LVE-G1000(532,Nano)

  • 特長・機能
  • 仕様
  • アプリケーション

The LVE-G1000 is a 10W green (532nm) nanosecond laser for micro-processing.
It offers the reliability and stability demanded for industrial use.

The LVE-G1000 is a highly functional Q-switched pulsed laser. It uses Nd:YV04 crystal and is designed to process any kinds of materials. Combining its short pulse width with a high beam quality, it can achieve extremely high quality results in micro-processing.

Main characteristics
Air cooling with minimal maintenance

With our expertise on thermal analysis and thermal control technology, we achieved an air-cooling system for this kind of high power laser. This makes the maintenance much easier and lowers significantly the running-cost.

Extremely compact Q-switched DPSS Laser

Its very small size makes it easier to insert into the system, allowing greater design flexibility.

Beam Property
Wavelength 532nm
Average Power > 10W @ 50 kHz
Repetition Rate Single shot to 200kHz
Pulse Width 15nsec @ 50kHz / 10nsec @ 20kHz
Beam Diameter 1.0 mm
Beam Divergence 4.5 mrad (Full Angle)
Mode Quality M2 < 1.3
Spatial Mode TEM00, Linear Polarization
Stability +/- 2%

The above information may be updated without notice. Please verify these specifications with Spectronix or the seller before purchasing.

System Configuration
Laser Head W 150 x D 350 x H 125 mm 8kg
Laser Controller W 250 x D 380 x H 400.5 mm 26kg
Cooling System Air cooled (Laser head and Controller)
Power Supply Single Phase AC 100 to 240V +/- 10%, 50/60Hz
Power Consumption Maximum 1000W
External Control External Trigger (TTL)
Warm-up Time < 20 min from cold start, < 5 min from warm start
Operational Temperature 15 to 35°C
Storage Temperature 0 to 50°C
Operational and Storage Humidity Levels 10 to 85%RH (Non-condensing)

The above information may be updated without notice. Please verify these specifications with Spectronix or the seller before purchasing.

View All Applications
  • Laser micromachining
    • Cutting
    • Scribing
    • Thin Film Ablation
    • Drilling
    • Trimming
    • Repairing
    • Marking
    • Grafting Materials
    • Submicron Processing